发明名称 Multi-substrate liquid metal high-frequency switching device
摘要 A device and manufacturing method are provided that comprises forming first and second substrates joined together and comprising a main channel provided in at least one of the substrates and a connecting channel provided in at least one of the substrates, the connecting channel connected to the main channel, and the main channel having spaced apart electrodes and at least partially filled with liquid metal. The method further comprises forming a heater substrate comprising a suspended heater element in fluid communication with the connecting channel, the suspended heater element operable to cause a fluid non-conductor to separate the liquid metal and selectively interconnect the electrodes, and providing a high-frequency signal loss reduction structure between the main channel and the heater substrate.
申请公布号 US2004150491(A1) 申请公布日期 2004.08.05
申请号 US20030738539 申请日期 2003.12.16
申请人 KONDOH YOU;TAKENAKA TSUTOMU 发明人 KONDOH YOU;TAKENAKA TSUTOMU
分类号 H01H11/02;H01H1/00;H01H29/02;H01H29/28;H01H29/30;H01H61/01;H01H61/02;(IPC1-7):H01P1/22 主分类号 H01H11/02
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