| 发明名称 |
LEAD FRAME, ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE USING THE SAME AND ITS MANUFACTURING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is easy to manufacture, extremely thin, and high in reliability. <P>SOLUTION: Using a lead frame composed of a main body of the lead frame made of a metal plate, grooves for forming the leads formed in a desired depth in the lead forming areas of the surface of the main body of the lead frame, lead parts which are formed on the surface of the main body of the lead frame to protrude using a material different from that of the main body of the lead frame, the main body of the lead frame is removed by etching after the chip is mounted to provide the thin semiconductor device. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
| 申请公布号 |
JP2004221399(A) |
申请公布日期 |
2004.08.05 |
| 申请号 |
JP20030008349 |
申请日期 |
2003.01.16 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KOBAYASHI TAKESHI;SUAI HISAO |
| 分类号 |
H01L23/48;C25D1/00;H01L21/56;H01L21/68;H01L23/31;H01L23/495;H01L23/50 |
主分类号 |
H01L23/48 |
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