| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance transmission characteristics of a high frequency signal being transmitted on a first line conductor and a second line conductor formed on the upper and lower surfaces of a dielectric substrate through a through conductor. <P>SOLUTION: In the high frequency wiring board, first and second ground conductors 3a and 3b on the same plane are extended to surround the end parts of first and second line conductors 2a and 2b circularly wherein the interval of surrounding the central side end parts of the first and second line conductors 2a and 2b is set larger than a specified interval of the line part of the first and second line conductors 2a and 2b and the ground conductors 3a and 3b on the same plane. Furthermore, a plurality of ground through conductors 5 for connecting the first and second ground conductors 3a and 3b on the same plane are arranged, in parallel at a constant interval, on the opposite sides of the first and second line conductors 2a and 2b, and four ground through conductors 5 are arranged on a circle surrounding a through conductor 4 at respective end parts of the first and second line conductors 2a and 2b. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
