| 摘要 |
An integrated heat-dissipating module includes a heat-dissipating device substantially in contact with a main heat-generating source on a motherboard, a casing capping over the main heat-generating source and substantially in contact with sub heat-generating sources installed around the main heat-generating source, and a heat-dissipating fan installed on a first vent of the casing. The heat produced by the main heat-generating source is transmitted to the air inside the casing via the heat-dissipating device. Then, the hot airflow concentrated within the casing is expelled from a second vent of the casing by the heat-dissipating fan. The casing is made of a high heat conducting material and has a plurality of external heat-dissipating fins extending outward from an outer surface of the casing for quickly transmitting the heat generated by the sub heat-generating sources to the outside. Heat produced by the main heat-generating source and the sub heat-generating sources is dissipated simultaneously.
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