发明名称 Wafer handling checker
摘要 A plurality of wafers 1 each having a conductive film on each face thereof are housed in each slot 11 of a cassette 10, and a potential of "H" level is applied from a control box 30 to each wafer 1 via each electrode 13. A conductive suction part 21 of a vacuum pincette 20 is connected to a grounding potential. An LED 13 corresponding to the wafer 1 to be operated is lit up by a specification from a computer 40 so that an operator operates the wafer 1 specified by the computer 40 using the vacuum pincette 20. The control box 30 detects the potential of each electrode 13 and decides as to whether a given wafer 1 is correctly operated or not. In the case of erroneous operation, such an erroneous operation is displayed by means of the buzzer 34, and an overall result of operation is stored in the computer 40.
申请公布号 US2004152314(A1) 申请公布日期 2004.08.05
申请号 US20030701471 申请日期 2003.11.06
申请人 INOUE HIROHITO 发明人 INOUE HIROHITO
分类号 H01L21/677;H01L21/00;(IPC1-7):H01L21/302;H01L21/461 主分类号 H01L21/677
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