发明名称 COOLING SYSTEM FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE EQUIPPED WITH COOLING SYSTEM
摘要 <p><P>PROBLEM TO BE SOLVED: To facilitate a cooling pipe fitting, prevent leakage of a liquid coolant, and improve operating efficiency, while preventing condensation and freezing by controlling the heat exchanging capacity of a heat exchanging unit in a cooling system for an electronic device and the electronic device equipped with the cooling system. <P>SOLUTION: A part of the cooling section is made flat, the flat section is allowed to contact each electronic part to cool it to facilitate the pipe fitting, the leakage of the liquid coolant is prevented by reducing the number of pipe connection sections, operating efficiency is improved, while preventing condensation and freezing, by controlling the heat exchanging capacity of the heat exchanging unit in the cooling system according to the atmospheric temperature, the temperature inside the electronic device and the temperature of the liquid coolant. Further, in the electronic device having the two electronic systems, the condensation and freezing are prevented in the cooling system on the standby side electronic system by sharing a liquid coolant tank of each cooling system for two electronic systems. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004221607(A) 申请公布日期 2004.08.05
申请号 JP20040053155 申请日期 2004.02.27
申请人 HITACHI KOKUSAI ELECTRIC INC;HITACHI LTD 发明人 KUROKAWA KENJU;SAITO AKIRA;FUKUKAWA TOSHIO;HARADA MAKIO;YAZAWA HIDEO;OGURO TAKAHIRO
分类号 F25D9/00;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 F25D9/00
代理机构 代理人
主权项
地址