发明名称 |
PRESSURE WAVE PRODUCING DEVICE AND METHOD OF PRODUCING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a pressure wave producing apparatus which has a structure suitable for manufacturing several sets of the pressure wave producing apparatus using a wafer and in which the releasing of ultrasonic wave is prevented in the case of wire-bonding to an input terminal and a manufacturing method of the same. SOLUTION: The pressure producing apparatus is provided with a substrate 1 and a heat insulating layer 2 provided on the substrate 1 and an electrically driven heating element thin film 3 provided on the heat insulating layer 2 . The pressure wave producing apparatus is further provided with a masking layer 6 on the substrate 1 around the heat insulating layer 2. The input terminal 4 is connected to the heating element thin film 3 and extends on the masking layer 6 and the wire-bonding is carried out to the input terminal 4. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004216360(A) |
申请公布日期 |
2004.08.05 |
申请号 |
JP20030047783 |
申请日期 |
2003.02.25 |
申请人 |
YAMATAKE CORP |
发明人 |
KIHARA TAKASHI;KOSHIDA NOBUYOSHI |
分类号 |
B06B1/02;(IPC1-7):B06B1/02 |
主分类号 |
B06B1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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