发明名称 PRESSURE WAVE PRODUCING DEVICE AND METHOD OF PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a pressure wave producing apparatus which has a structure suitable for manufacturing several sets of the pressure wave producing apparatus using a wafer and in which the releasing of ultrasonic wave is prevented in the case of wire-bonding to an input terminal and a manufacturing method of the same. SOLUTION: The pressure producing apparatus is provided with a substrate 1 and a heat insulating layer 2 provided on the substrate 1 and an electrically driven heating element thin film 3 provided on the heat insulating layer 2 . The pressure wave producing apparatus is further provided with a masking layer 6 on the substrate 1 around the heat insulating layer 2. The input terminal 4 is connected to the heating element thin film 3 and extends on the masking layer 6 and the wire-bonding is carried out to the input terminal 4. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004216360(A) 申请公布日期 2004.08.05
申请号 JP20030047783 申请日期 2003.02.25
申请人 YAMATAKE CORP 发明人 KIHARA TAKASHI;KOSHIDA NOBUYOSHI
分类号 B06B1/02;(IPC1-7):B06B1/02 主分类号 B06B1/02
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