发明名称 |
High speed circuit board and method for fabrication |
摘要 |
A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided. |
申请公布号 |
US2004150969(A1) |
申请公布日期 |
2004.08.05 |
申请号 |
US20030354000 |
申请日期 |
2003.01.30 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES INC. |
发明人 |
CHAN BENSON;LAUFFER JOHN M.;LIN HOW T.;MARKOVICH VOYA R.;THOMAS DAVID L. |
分类号 |
H01L23/12;H01L23/31;H01L23/538;H01L25/065;H01L25/18;H05K1/02;H05K1/11;H05K3/46;(IPC1-7):H05K1/11 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|