| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inner lead bonder capable of realizing a semiconductor device without causing reduction of the breakdown voltage and short-circuiting whereby inner leads and pellet electrodes can surely electrically be connected even when the arrangement pitch of the electrodes is narrowed. <P>SOLUTION: Notches 14 for guiding the leads 3a are formed on a circumferential edge of a lead pressing face 13a of a pressing body 13 for pressing the leads 3a. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
