| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition from which a resist thicker than plated wire and having no chip and no crack is formed, a rectangular resist pattern can be formed that has no roughness in the cross section but has excellent adhesion to a substrate, plating liquid resistance and excellent wettability against a plating liquid and is exfoliated easily by a removing solution after plated and which is suitable for forming a circuit on a packaged substrate or on a semiconductor chip by rewiring, and to also provide a circuit forming substrate, a resist pattern forming method, and a method for manufacturing a printed wiring board. <P>SOLUTION: This positive photosensitive resin composition contains an alkali-soluble novolac resin (A), an alkali-soluble acrylic resin (B) containing a radically polymerizable unit having a carboxyl group and/or a phenolic hydroxyl group of 5-40 wt.% per a recurring unit and a quinone diazido group-containing compound (C) of 5-50 wt.% on the basis of 100 wt.% resin (A). The film thickness of the resist formed from this positive photosensitive resin composition is made to be 5-30 μm. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
