IMPROVEMENT IN STRING SLICE METHOD FOR TAPE HEAD MANUFACTURING

摘要

PROBLEM TO BE SOLVED: To enhance a yield per wafer by using a thinner blade and reduce a rate of an error caused by the excursion of the blade in sawing, on dicing a membrane wafer. SOLUTION: A closure is joined to a section of the thin-film wafer. A string is sliced from the section of the wafer by the blade, wherein the closure and the thin-film wafer are through-sliced in a way that the reverse side of the blade engages with an equal surface area of the closure. COPYRIGHT: (C)2004,JPO&NCIPI