BRITTLE MATERIAL SPUTTERING TARGET ASSEMBLY AND METHOD OF MAKING SAME

摘要

A method for producing a sputtering target assembly made from a material with a low coefficient of thermal expansion solder bonded to a backing plate with a coefficient of thermal expansion similar to that of the target assembly material. The method includes heat treating the target assembly material and backing plate, solder bonding the target assembly material and backing plate, and slowly cooling the assembly to room temperature. Matching the coefficients of thermal expansion of the target assembly material and backing plate minimizes distortion in the assembly caused from deflection and internal stress.