| 摘要 |
<P>PROBLEM TO BE SOLVED: To fabricate a thin board equipped with a circuit and an antenna inside to be formed. <P>SOLUTION: The thin board is equipped with a semiconductor layer 10a where the circuit 3 is formed and an antenna board 10b where the antenna 1 is formed. The semiconductor layer 10a and the antenna board 10b are joined together, and the semiconductor layer 10a is formed by isolating the board 10b containing an isolation layer by the isolation layer. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
