BALL GRID ARRAY PACKAGE CONSTRUCTION WITH RAISED SOLDER BALL PAD

摘要

PROBLEM TO BE SOLVED: To provide a BGA solder ball interconnection to an outer conductive layer of a multilayer circuit assembly having an internal circuit layer.

SOLUTION: The interconnection includes a raised BGA solder ball pad formed on the substantially same plane as the outer conductive layer 13b. The raised pad 32a has a raised surface 7 and a plurality of vertical conductive walls 33 wherein the average diameter of BGA solder balls 39 is larger than the width of the raised surface and the BGA solder balls adhere to a substantial portion of the raised surface and the vertical conductive wall.

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