| 发明名称 |
NON-TRANSMITTING POLYIMIDE COVER LAY FILM AND NON-TRANSMITTING EPOXY RESIN ADHESIVE AGENT |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a non-transmitting and non-reflecting polyimide cover lay film and a non-transmitting epoxy resin adhesive agent wherein a production process is simplified, a producibility is increased and a production cost is saved. <P>SOLUTION: The non-transmitting polyimide cover lay film comprises a protecting film layer consisting of a polyimide film having chemical resistance and high temperature resistance and an adhesive layer consisting of a non-transmitting and non-reflecting epoxy resin adhesive agent containing carbon black powder of 1.0-10.0 phr. The resin adhesive agent is coated or adhered to the protecting film layer, whereby non-transmitting and non-reflecting properties can be given to the protecting film layer. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
| 申请公布号 |
JP2004216870(A) |
申请公布日期 |
2004.08.05 |
| 申请号 |
JP20030402685 |
申请日期 |
2003.12.02 |
| 申请人 |
THINFLEX CORP |
发明人 |
WANG MEI-YEN;CHUAN-YI HUANG;JIANG YING-TEH |
| 分类号 |
B32B27/34;C08J7/04;C09J7/02;C09J109/02;C09J163/00;H01L23/29;H01L23/495;H05K1/02;H05K3/28;H05K3/38;(IPC1-7):B32B27/34 |
主分类号 |
B32B27/34 |
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