| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC package capable of miniaturizing, and a manufacturing method therefor. SOLUTION: A conductor pattern 4 is formed on one surface of a resin film 2 made of thermoplastic resin, and the IC chip 3 having an electrode 3b is mounted on a single-sided conductor pattern film 7 including a viahole 5 where an interlayer connecting material 6 is filled on a desired position of the conductor pattern 4 as a base. At that time, the electrode 3b is arranged in the viahole 5 and bonded with the interlayer connecting material 6, and then a joining part thereof is sealed with the thermoplastic resin. The both faces of the single-sided conduction pattern film 7 can be used for mounting the IC chip 3 and bonding with a circuit board 10, and therefore the IC package 1 can miniaturized. COPYRIGHT: (C)2004,JPO&NCIPI |
