| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor apparatus which can prevent thermal damage, has high reliability of connection, and has lead-free ball electrodes. SOLUTION: A semiconductor apparatus 100, which is equipped with a semiconductor device 5 having a plurality of device electrodes and with the ball electrodes 1 connected electrically to at least one of a plurality of the device electrodes, is provided. The ball electrode 1 comprises a Sn-Zn lead-free solder alloy of which 7-9.5 % by weight are zinc and the rest of which is tin. COPYRIGHT: (C)2004,JPO&NCIPI |
