APPARATUS FOR EVALUATING INHERENT CHARACTERISTIC OF ADDITIVE ON GROWTH IN ELECTROLYTIC PLATING, ELECTROLYTIC PLATING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To solve a problem in electrolytic plating that unless a semiconductor substrate is immersed in a plating bath and copper of the main material is actually deposited, the balance and the controllability of various additives can not be determined. SOLUTION: This evaluating apparatus has a first graph-making means for plotting variations of precipitation quantity corresponding to variations in a rotation speed with respect to additive concentrations; a second graph-making means for approximating a curve of each additive concentration in the produced graph into two straight lines in regions of the low rotation speed and a high rotation speed, determining an intersection point of the two straight lines, plotting the precipitation quantity corresponding to the rotation speed on every additive concentration, and approximating the points into a straight line to make the graph; and a means for calculating a gradient of the straight line obtained by the above means as the inherent characteristic value of the additive, arranged in a CVS (cyclic voltammetric stripping) instrument. COPYRIGHT: (C)2004,JPO&NCIPI