| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding device for grinding a wafer formed by slicing an ingot to flatten its surface while preventing the formation of a ring protrusion around the outer peripheral edge of a ground substrate. SOLUTION: In the substrate grinding device, the substrate w obtained by slicing the ingot is held on a suction chuck 51, a cup wheel type grinding wheel journaled to a spindle on the upper face side of the substrate is pressed thereagainst and the suction chuck and the cup wheel type grinding wheel are slid to grind the substrate surface. The face of the suction chuck for sucking the substrate is provided with an elastic sheet 51b which has a circular groove 51f similar to the outer periphery of the substrate, 0.05-2 mm wider than the outer periphery of the substrate and 0.5-3.0 mm deep, provided in the surface where the elastic sheet 51b of a thickness of 2.0-5 mm having a hole of a diameter of 0.5-2 mm is adhered to the surface of a rigid suction plate 51a. The substrate w, when ground, is placed on the surface of the elastic sheet 51b in the circular groove. COPYRIGHT: (C)2004,JPO&NCIPI
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