PLATING DEVICE AND PLATING METHOD

摘要

A plating device capable of selectively depositing metal plating films such as copper layers in fine recessed parts for wiring formed of circuit-shaped trenches and via holes, comprising an electrode head (701) having an anode (704), a plating liquid impregnated material (703) holding plating liquid, and a porous contact body (702) in contact with the surface of a substrate, a cathode electrode (712) in contact with the substrate for energization, a pressing mechanism (709) controllably pressing the porous contact body of the electrode head against the surface of the substrate, a power supply (723) applying a plating voltage between the anode and the cathode electrode, and a control part (721) controlling the pressed state of the porous contact body of the electrode head against the surface of the substrate and the state of the plating voltage applied between the anode and the cathode electrode in association with each other.