发明名称 Geschmiedetes Gehäuse aus Magnesiumlegierung und Verfahren zu dessen Herstellung
摘要 <p>A thin, forged magnesium alloy casing is integrally constituted by a thin plate with projections on either or both surfaces, and the thin plate is as thin as about 1.5 mm or less. The thin forged casing can be produced by (a) roughly forging a magnesium alloy plate to form an intermediate forged product under the conditions of a preheating temperature of the magnesium alloy plate of 350 to 500 DEG C, a die temperature of 350 to 450 DEG C, a compression pressure of 3 to 30 kbar, a compressing speed of 10 to 500 mm/s and a compression ratio of 75 % or less; and (b) precisely forging the intermediate forged product under the conditions of a preheating temperature of the intermediate forged product of 300 to 500 DEG C, a die temperature of 300 to 400 DEG C, a compression pressure of 1 to 20 kbar, a compressing speed of 1 to 200 mm/s, and a compression ratio of 30% or less. <IMAGE></p>
申请公布号 DE69913018(T2) 申请公布日期 2004.08.05
申请号 DE1999613018T 申请日期 1999.03.23
申请人 TOKYO SEITAN INC., NIIGATA;SONY CORP., TOKIO/TOKYO 发明人 SEKI, ISAO;HAMA, SHIGEO;TANIIKE, SHIGEHIRO;WATANABE, FUKASHI;KAKIZAKI, MASAHIKO;SEKI, SHINJI
分类号 B21J5/02;B21K21/02;H05K5/02;(IPC1-7):B21K21/02;C22F1/06 主分类号 B21J5/02
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