PRESSURE SENSITIVE ADHESIVE SHEET, METHOD OF PROTECTING SEMICONDUCTOR WAFER SURFACE AND METHOD OF PROCESSING WORK

摘要

A pressure sensitive adhesive sheet that even when used in processing including heating or heat generating treatment, would not adhere to other equipment, etc. In particular, a pressure sensitive adhesive sheet of unprecedented high temperature thermal resistance for semiconductor wafer processing, which endowed with properties such as capability of circuit surface protection and expandability, can be used as a surface protective sheet, dicing sheet or pickup sheet. Such a pressure sensitive adhesive sheet is characterized in that it comprises a substrate obtained by forming a first hardening resin into a film and hardening the same and, superimposed on major surfaces thereof, a top coat layer obtained by coating with a second hardening resin and hardening the same and, opposite to the top coat layer, a pressure sensitive adhesive layer.