SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, CIRCUIT BOARD AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a through electrode of high quality.

SOLUTION: A recess 22 is cut in the first surface 20 of a semiconductor substrate 10 where an integrated circuit 12 is formed. A conductive part 30 is provided to the recess 22. The conductive part 30 is made to protrude from the second surface 38 of the semiconductor substrate 10 opposite to its first surface 20. The conductive part 30 is ground or polished until its new surface is exposed.

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