| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding tool and a bonding device for electronic parts capable of simply and speedily effecting exchange of a suction part and further having the oscillation characteristics of the suction part non-susceptible to the exchange of the suction part. <P>SOLUTION: The bonding tool is adapted to crimping of an electronic part 40 onto a target surface to be bonded under application of a load and oscillation to the electronic part 40. The tool is provided with an oscillator for providing an oscillation to the horn 15, a suction part 30 removably attached to the horn 15 for vacuum-sucking the electronic part on a suction hole 30a, and an abut member 37 that abuts against the suction part 30, which are all secured in a clamped manner to the horn 15 to resiliently press and fix the suction part 30 to the horn 15. In this way, the speedy exchange of the suction part, the maintaining of a stable fixation state, and the sustaining of stable oscillation characteristics can be attained. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
