发明名称 |
FILM CARRIER TAPE FOR ELECTRONIC MOUNTING AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a film carrier tape for electronic mounting which is excellent in migration resistance and adhesiveness between the insulator film and the wiring, and its manufacturing method. SOLUTION: This film carrier tape for electronic component mounting has: (1) a seed layer 16 comprising a zinc layer formed on the treated surface of an insulator film 12 and a nickel-based metal layer formed on the surface of the zinc layer, (2) a seed layer 16 comprising an alloy layer which is made of an alloy containing specified amounts of nickel and aluminum and is formed on the treated surface of the insulator film 12, or (3) a continuous zinc coating layer containing zinc over at least a part of a region extending from the edges at width direction of wiring 14 to the surface of the insulator film 12. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004221548(A) |
申请公布日期 |
2004.08.05 |
申请号 |
JP20030407541 |
申请日期 |
2003.12.05 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
KATAOKA TATSUO;AKASHI YOSHIICHI |
分类号 |
H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
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