| 摘要 |
PROBLEM TO BE SOLVED: To constitute a multilayer substrate having a whole-layer IVH structure by which a sure interlayer electrical connection can be obtained and a double-sided mounting is enabled without requiring a separate lamination or the like of a conductor layer, and without losing the advantage of a collective lamination. SOLUTION: The conductor layers formed in wiring patterns 12 and 13 are formed on both surfaces of an insulating base material 11, a via hole 14 having a specified diameter is formed to the conductor layer (12) on one surface and the base material 11, and a small hole 15 having a diameter smaller than the via-hole diameter opened to the via hole 14 is bored to the conductor layer (13) on the other surface. The via hole 14 and the small hole 15 are filled with conductive paste 16, and the conductive paste 16 contains an expanding section 17 expanded in a flange shape on the conductor layer (12) in a via-hole opening. COPYRIGHT: (C)2004,JPO&NCIPI |
