| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent sticking of a wafer having a relatively small diameter of 200 mm and a light dead weight to an upper plate side, drying of the wafer surface and the flotation of the wafer from a lower plate side. <P>SOLUTION: This double side polishing device comprises a plurality of carriers 23 for holding works 10 to be polished, adapted to be rotated between the upper and lower plates 21, 22 being rotated when polishing the works 10 at their double sides at the same time. The upper plate 21 has a nozzle portion to be opposed to the upper face of each work located between the plates upon finishing polishing. After finishing polishing, when the upper and lower plates 21, 22 are separated from each other, liquid and gas are jetted from the nozzle portion at the same time. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
