| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an SRAM chip that can be easily stacked and bonded in a memory, in a plurality of memories capable of stacking large capacity SRAM chips and a large capacity SRAM chip mounted to a system LSI. <P>SOLUTION: In a semiconductor device 1, address pads A'0-A'22, where a specific address signal is supplied to a circuit block from the outside, and data I/O pads DQ0-DQ15 for inputting and outputting data from and to the circuit block are formed on a semiconductor chip 10; the data I/O pads are arranged along the first side of the semiconductor chip 10; the address pads are arranged along a second side sharing one of the corners of the semiconductor chip with the first side; and the data I/O pads are not arranged on the second side. The address pads A0-A22 and data I/O pads DQ0-DQ 15 are concentratedly arranged on one side and the other of the chip, respectively, thus facilitating laminating and bonding. As a result, in the semiconductor device where a plurality of chips are laminated, a bonding pad is arranged on two adjacent sides of the chip and the address pads and the data I/O pads are arranged on one side and the other, respectively, thus facilitating the laminating of the chip and the bonding. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
