| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the wire bonding accuracy by attaching temperature sensors 30 to a bonding arm 13 and a recognition lens 10 to monitor the temperatures of the parts and correcting the deviation of the bonding position due to the thermal expansion resulting from the temperature rise thereof. <P>SOLUTION: Using temperature sensors 30 attached to a bonding arm 13 and a recognition lens 10 of a wire bonder, the temperature rise of the bonding arm 13 and the lens 10 is monitored to calculate the radiation heat of a heater unit 20, the thermal expansion due to heat generated by a Z-axis drive and the thermal expansion quantity from the temperature rise, thereby correcting the position relation of a recognized position to an actual bonding point. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
