| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device that is capable of increasing parts, such as ICs and the like, which are housed inside it so as to improve in degree of integration and get multifunctional, transmitting high-frequency signals efficiently, and improved in reliability of internal airtightness. SOLUTION: A wiring board 5 is equipped with a plurality of first electrode pads 6a formed on the top surface of an insulating board composed of a plurality of laminated insulating layers and a plurality of second electrode pads 7a arranged in two rows on the undersurface of the insulating board. The first electrode pads 6a and the corresponding second electrode pads 7a are electrically connected together with through-conductors 8a through the intermediary of internal conductor layers 8b provided inside the insulating board, and external connection pins 10 are joined to the second electrode pads 7a, respectively. COPYRIGHT: (C)2004,JPO&NCIPI |
