| 摘要 |
PROBLEM TO BE SOLVED: To provide the forming method of a porous film with a regular structure uniform over an entire face of an optional substrate and to provide a forming apparatus therefor. SOLUTION: The method for forming a porous film with the fine regular structure on the substrate sequentially includes a first step of preparing a film forming solution containing an organometallic compound, an organic solvent, water and a surface active agent; a second step of passing the film forming solution through micro channels of a first channel member wherein many of the micro channels whose width is 5 mm or below are placed adjacent to each other in the widthwise direction, and thereafter coating the solution on the optional substrate surface to form a film thereon; and a third step of applying porous processing to the film obtained in the second step. Having only to coat the film forming solution including the organometallic compound, the organic solvent, the water and the surface active agent on the optional substrate through the micro channels of a particular shape to form the film can easily obtain a porous film having a regular structure over the entire substrate. The porous film having the regular structure as above can properly be used for interlayer insulating materials for LSIs wherein further high circuit integration is an objective, catalyzers, sensors, and chemical electrodes or the like because its mechanical strength is not reduced. COPYRIGHT: (C)2004,JPO&NCIPI
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