| 摘要 |
PROBLEM TO BE SOLVED: To reduce the production cost of an EL (electroluminescent) layer, to make excellent the uniformity in the film deposition of the EL layer and throughput, and to avoid the contamination by impurities by increasing the utilizing efficiency of an EL material. SOLUTION: In the production device, a substrate 100 is fixed, and a vapor deposition holder 104 is moved for film deposition. After the vapor deposition holder is moved from a film deposition chamber 101 to an installation chamber 103b, the parts (a crucible 106, a film thickness monitor 105, and a shutter) of the vapor deposition holder are installed without contact with air. Further, after the vapor deposition holder is moved from the film deposition chamber to the installation chamber 103b, the parts of the vapor deposition holder, typically the film thickness monitor, shutter or the like, are subjected to cleaning. Thus, the parts exchange frequency is reduced, and the cleanliness inside the film deposition chamber can be retained. COPYRIGHT: (C)2004,JPO&NCIPI
|
