| 摘要 |
PROBLEM TO BE SOLVED: To realize a supply of a purge gas to the circumference of a substrate with a simpler configuration. SOLUTION: The substrate treatment apparatus is provided with a treatment chamber 1 for treating a wafer W therein with the use of a raw gas, a substrate support 2 for supporting the wafer W in the treatment chamber 1, a purge gas duct 4 for supplying the purge gas to the circumference of the wafer W supported by the substrate support 2, which has a purge gas supply port 3 of an outlet. The apparatus has further a cover member 5 which surrounds the substrate support 2 to form a buffer space S of the purge gas between itself and the substrate support 2, and composes the purge gas duct 4 so as to include the buffer space S. COPYRIGHT: (C)2004,JPO&NCIPI
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