THERMOSETTING POLYIMIDE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE RESIN, AND POLYIMIDE RESIN

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting polyimide resin composition which gives a cured article with an excellent heat resistance, low dielectric constant and dielectric dissipation factor, and good mechanical properties (e.g. tensile strength and elongation); and a method for producing a polyimide resin used for the polyimide resin composition. SOLUTION: The thermosetting polyimide resin composition comprises a polyimide resin (X) having carboxyl groups and ester structures of a 10-20C fatty acid and an epoxy resin (Y). The method for producing the polyimide resin (X) comprises reacting a polyisocyanate compound (a1) with a fatty acid ester (a2) prepared from a 10-20C fatty acid and having at least two hydroxyl groups and reacting the resultant isocyanate-terminated prepolymer (A) with an anhydride (B) of a polycarboxylic acid having at least three carboxyl groups in an organic solvent. COPYRIGHT: (C)2004,JPO&NCIPI