| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package mounting structure wherein short circuit due to solder flakes or solder balls is prevented. SOLUTION: In this package mounting structure wherein a semiconductor package 1 having a heat sink 15 for a semiconductor chip is soldered to a printed board 2 by a reflow process, the area of a heat radiating metallic pattern 4 is designed to be larger than the area of the heat sink 15, and the region on the metallic pattern 4 except for the connection section for the heat sink 15 is divided into an inner region which is in contact with the circumference of the heat sink connection section and an outer region which is in contact with the outer circumference of the inner region. A solder resist 12 is formed in the inner region which is in contact with the heat sink connection section, and a narrow gap 8 is formed therein. The outer region is a trap member 4a wherein the metal section of the metallic pattern 4 is exposed, and a wide gap 9 is formed in between the trap member 4a and the semiconductor package 1. COPYRIGHT: (C)2004,JPO&NCIPI
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