METHOD FOR MOUNTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To solve the problem that the lead-free solder is inferior to the Sn-Pb solder in solder wettability and hard to adapt to the terminal of a mounted component, which decreases a bonding quality after a reflow because of the small bonded area. SOLUTION: A solder paste is coated thickly to the edge other than the part covered by a terminal by the use of a coating device for discharging solder paste from a nozzle and for coating the predetermined place of a printed wiring board 5, and varying the thickness of a coated film of the solder paste 3 according to the terminal shape of the mounted component 9 to a land 10. In this way, the method for mounting an electronic component capable of securing the solder bonding strength can be obtained by wetting the solder thick on the side of the component terminal after the reflow. COPYRIGHT: (C)2004,JPO&NCIPI