Plasma-activated layer deposition process by cathodic sputtering according to the magnetron principle for producing thin layers of metals and metal alloys comprises reducing the absolute value of the magnetic field strength

摘要

Plasma-activated layer deposition process by cathodic sputtering according to the magnetron principle comprises reducing the absolute value of the magnetic field strength of a magnetron magnetic field to a value which reduces the discharge flow of the magnetron discharge by at least 20 %. An independent claim is also included for a device for plasma-activated layer deposition.