Method and device for controlling the edge of a disc shaped arcticle

摘要

A robot's (1) arm (2) has a gripper (4) set up for handling thin semiconductor wafers and, optionally, allocated to incoming (6) and outgoing (8) racks. The incoming rack has a station (12) for 'wafer mapping'. In an inspection station (20) there is an inspection chuck (22) with a line sensor (24) as well as an optical sensor head (28) that moves linearly with the help of a linear sledge (26). An independent claim is also included for a device for controlling the edge of a semiconductor wafer during inspection processes with moving robots and charge coupled device (CCD) cameras.