| 摘要 |
PURPOSE: A multi chip module structure by using a low temperature co-fired ceramic is provided to reduce the parasitic component and electro-magnetic wave as well as to reduce the overall layout simultaneously. CONSTITUTION: A multi chip module structure by using a low temperature co-fired ceramic includes a mount substrate(41), a signal substrate(42), a pair of pattern substrates(43,44) and a ground substrate(45). A plurality of electrical components are formed on the mount substrate(41) for performing the signal generation and control function to drive the flat display panel. A plurality of terminals is formed on the signal substrate(42). The pair of pattern substrates(43,44) is placed between the mount substrate(41) and the signal substrate(42) and is provided with patterns so as to implement the transmission of the signal between the plurality of electrical components and the terminals. And, the ground substrate(45) is connected to the ground. |
