发明名称 |
Multi-chip electronic package having laminate carrier and method of making same |
摘要 |
A multi-chip electronic package which utilizes an organic, laminate chip carrier (2) and a plurality of semiconductor chips (3) positioned on an upper surface of the carrier. The organic, laminate chip carrier is comprised of a plurality of conductive planes (4) and dielectric layers and couples the chips (3) to underlying conductors (8) on the bottom surface thereof. The carrier may include a high-speed portion to assure high-frequency connection between the semiconductor chips and may also include an internal capacitor and/or thermally conductive member for enhanced operational capabilities. |
申请公布号 |
EP1443560(A2) |
申请公布日期 |
2004.08.04 |
申请号 |
EP20040250436 |
申请日期 |
2004.01.28 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
FRALEY, LAWRENCE R.;MARKOVICH, VOYA R. |
分类号 |
H01L23/12;H01L23/31;H01L23/538;H01L25/04;H01L25/065;H01L25/18;H05K1/02;H05K1/11;H05K3/46 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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