New polymers and objects, mouldings or the like prepared therefrom, their preparation process and process for the preparation of metallized objects or the like therefrom

摘要

Metallisable (co)polymers and formed products made therefrom comprise non-metallisable base polymers (e.g. polyolefins, acrylics, polyesters etc.) grafted with monomeric maleimide derivatives containing two or more salt-forming or complex-forming ligands for interaction with coating metals. Polymers or copolymers (P1) which are prepared for the application of a stable, adherent metal coating (by electroless or electrolytic deposition of metal(s)), or finished products, mouldings, semi-finished products, profiles, sheet, plates, film, tapes, fibres, granules etc. obtained by forming P1. The surface(s) of these materials comprise a base (co)polymer which is not (or only with difficulty or insufficiently) susceptible to such metal deposition (selected from polyolefins, poly-(2-17C alkenes), polyethylene, polypropylene, polystyrenes, partly chlorinated/fluorinated polyalkylenes, polyvinyl halides, poly-(1-17C alkyl (meth)acrylates), polyacrylonitriles, polyethylene terephthalates, polyacetals, polycarbonates and polyamides), grafted with monomeric maleimide(s) of formula (I). A : (a) X 1(CH 2) nX(CH 2) mX 2 (Ia), (b) one of the two groups of formula (Ib), (c) one of the five groups of formula (Ic) or (d) S 1YS 2Z (Id); X : CH or N; X 1, X 2OH, COOH, CONH 2, COR 2, CO(CH 2) pCOR 2 or -C(=NOH)(CH 2) pC(=NOH)R 2, with the proviso that either X 1 or X 2 may also be H; R 21-6C alkyl or 6-12C aryl; n, m : 0-3; R 1H, OH, COOH, CONH 2, NH 2 and/or NO 2; S 1, S 2bond, 1-10C alkylene or 6-12C arylene; Y : C(O)O, OC(O), NHC(O), C(O)NH, NHC(O)O, NHC(O)ONH, OC(O)NH or O; Z : as for A (except for the diarylazo group). Independent claims are also included for (1) method (M1) for production of P1 by (preferably radically) grafting the above base (co)polymers with maleimide derivatives (I) (2) a method (M2) for metal-coating objects, mouldings etc. as above by forming the required substrate from P1 (e.g. by extrusion or injection moulding), contacting the surface directly (without any conventional pretreatment with functionalising chemicals) with an activating solution for metal deposition (preferably containing a palladium complex), reducing the complex to the metal (preferably Pd) and then electroplating with the required metal [Image] [Image].