发明名称 HEAT COLLECTOR WITH MOUNTING PLATE
摘要 <p>A heat collector ( 50 ) is formed by at least one extruding step for reducing machining steps, and is assembled to a separately formed mounting frame ( 40 ) which may be stamped and formed or molded. The heat collector has flanges ( 53 ) which bear against retaining tabs ( 45 ) formed on the mounting frame, and may be held by solder, glue, or mechanical means. The heat collector may receive a heat dissipator ( 18 ), or may be formed as a heat sink ( 56 ) such as a pin-fin type heat sink. The mounting frame can be fixed to a printed circuit board or the like having a component such as a central processing unit which contacts the collector in order to cool the unit.</p>
申请公布号 EP1442265(A1) 申请公布日期 2004.08.04
申请号 EP20020778504 申请日期 2002.10.10
申请人 AAVID THERMALLOY LLC 发明人 GAILUS, DAVID, W.;CLEMENS, DONALD, L.
分类号 F25D1/00;H01L23/40;F25D9/00;F28D15/00;F28D15/02;F28F13/00;H01L23/367;H01L23/427;H05K7/20;(IPC1-7):F28D15/00 主分类号 F25D1/00
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