发明名称 |
HEAT COLLECTOR WITH MOUNTING PLATE |
摘要 |
<p>A heat collector ( 50 ) is formed by at least one extruding step for reducing machining steps, and is assembled to a separately formed mounting frame ( 40 ) which may be stamped and formed or molded. The heat collector has flanges ( 53 ) which bear against retaining tabs ( 45 ) formed on the mounting frame, and may be held by solder, glue, or mechanical means. The heat collector may receive a heat dissipator ( 18 ), or may be formed as a heat sink ( 56 ) such as a pin-fin type heat sink. The mounting frame can be fixed to a printed circuit board or the like having a component such as a central processing unit which contacts the collector in order to cool the unit.</p> |
申请公布号 |
EP1442265(A1) |
申请公布日期 |
2004.08.04 |
申请号 |
EP20020778504 |
申请日期 |
2002.10.10 |
申请人 |
AAVID THERMALLOY LLC |
发明人 |
GAILUS, DAVID, W.;CLEMENS, DONALD, L. |
分类号 |
F25D1/00;H01L23/40;F25D9/00;F28D15/00;F28D15/02;F28F13/00;H01L23/367;H01L23/427;H05K7/20;(IPC1-7):F28D15/00 |
主分类号 |
F25D1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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