| 摘要 |
A method for forming several soldered joints, comprising the steps of mechanically soldering the joints; visually assessing the joints by means of a video camera (6,fig.2) connected to a computing device 9, the computing device storing assessment criteria for the soldered joints; and correctively soldering joints which do not meet the relevant quality standards. The corrective soldering is preferably automatically controlled by the computing device, and may be carried out with the same soldering device as the original mechanical soldering. The method may be used for soldering printed circuit boards. Also claimed is an apparatus for carrying out the method. The apparatus is preferably made up of the soldering device described in the Dutch patent NL 1017843. |
