Method for efficient capillary underfill

摘要

Methods for underfilling a gap between a component (12) and a component carrier (14), such as a die (12) joined to a substrate (14) by solder electrical interconnections, with an underfill material (26). One or more chambers or passageways (16) are provided in either the component carrier (14) at a location beneath the intended position of the component (12) or in the component (12) itself. The component (12) and component carrier (14) are heated and a volume of underfill material (26) is introduced into each passageway (16). After introduction, the underfill material (26) flows or moves to fill the gap (28) between the component and the component carrier. A fillet (38,40) may be optionally formed by adjusting the temperature during the underfilling operation.