发明名称 |
Method and device for placing and remelting shaped pieces consisting of solder material |
摘要 |
A method and a device for placing a multitude of shaped parts of solder material (20) on a bond pad arrangement (29) of a substrate (23), said bond pad arrangement comprising a multitude of bond pads (28), and for subsequent re-melting of the shaped parts of solder material on the bond pads (28), with arrangement of a template device (21) comprising a multitude of template apertures (27) for accommodating shaped parts of solder material (20) opposite a substrate (23) comprising a bond pad arrangement (29), such that the shaped parts of solder material are associated with the individual bond pads (28); and application of laser energy to the shaped parts of solder material (20) accommodated in the template apertures (27) using a laser device (39) arranged at the rear of the template device (21) such that said laser energy is applied to the shaped parts of solder material through the template device.
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申请公布号 |
US6769599(B1) |
申请公布日期 |
2004.08.03 |
申请号 |
US20010763785 |
申请日期 |
2001.11.13 |
申请人 |
PAC-TECH-PACKAGING TECHNOLOGIES GMBH |
发明人 |
MOMENI KAVEH;AZDASHT GHASSEM |
分类号 |
B23K1/00;B23K1/005;B23K3/00;B23K3/06;B23K101/42;H05K3/34;(IPC1-7):B23K1/005;B23K26/03 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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