发明名称 System and method for testing integrated circuit modules
摘要 Verification testing of modules packaged within an integrated circuit are conducted utilizing I/O ports of the integrated circuit for inputting or outputting incoming and outgoing signals, with three sets of externally controlled, tri-state buffers provided for each module. A first set selectively connects predetermined I/O contacts of each module interconnected to contacts of other modules, a second set selectively connects predetermined I/O contacts of each module to the I/O ports and a common test bus, and a third set applies the last logic state on each I/O contact before isolation by a buffer from the first set. Whenever a module is selected for testing, the current value that appears on each I/O contact that is connected to other modules is stored in its corresponding bus holder, so as to essentially prevent DC leakage currents.
申请公布号 US6771087(B1) 申请公布日期 2004.08.03
申请号 US20020162421 申请日期 2002.06.04
申请人 ADVANCED MICRO DEVICES, INC. 发明人 OZ OVED;MIZRAHI ABRAHAM
分类号 G01R31/317;G01R31/3185;(IPC1-7):G01R31/02 主分类号 G01R31/317
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