发明名称 Plated material, method of producing same, and electrical/electronic part using same
摘要 To provide a plated material having both high heat-resistance and good insertability/extractability. The plated material comprises an undercoating of any one of metals belonging to group 4, group 5, group 6, group 7, group 8, group 9 or group 10 of the periodic table or an alloy containing any one of those metals as a main component, an intermediate coating of Cu or a Cu alloy, and a top-coating of Sn or an Sn alloy, the undercoating, the intermediate coating and the top-coating being formed on a surface of an electrically conductive base in this order, and the thickness of the top-coating is 1.9 times or more the thickness of the intermediate coating.
申请公布号 US6770383(B2) 申请公布日期 2004.08.03
申请号 US20020247319 申请日期 2002.09.18
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 TANAKA HITOSHI;MATSUDA AKIRA;SUZUKI SATOSHI;TANIMOTO MORIMASA
分类号 C23C26/00;C23C28/02;H01R13/03;(IPC1-7):H01R13/03;C25D3/00 主分类号 C23C26/00
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