| 摘要 |
A semiconductor device (200) that includes a semiconductor substrate (210), semiconductor features (230, 235, 240, 260) located thereover and an insulating photoconductive layer (270) coupling the semiconductor features (230, 235, 240, 260). The photoconductive layer (270) is configured to provide conductivity between the semiconductor features (230, 235, 240, 260) in a presence of a plasma.
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