摘要 |
When contact holes are concurrently formed in an inter-level insulating layer over an impurity region in a silicon substrate and a polycide line on a thick field oxide layer, the manufacturer interrupts the etching at the refractory metal silicide layer of the polycide line, and restarts the etching after removal of a part of the refractory metal silicide layer exposed to the short contact hole, thereby preventing the impurity region from undesirable etching for the refractory metal silicide layer.
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