| 摘要 |
<p>A wire bond pad in an electrical circuit device package and method theref or including forming an opening in a conductor of a first electrically conducti ve material, forming a conducting member of a second electrically conductive material, transferring the conducting member into the opening of the conductor, electrically contacting the conducting member with the conductor, and embedding conductor with the conducting member in the opening thereof in an insulating electrical circuit device package.</p> |
